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| INTEGRATED CIRCUITS DATA SHEET TEA1111A Speech circuit with dialler interface, regulated supply and earpiece volume control Product specification Supersedes data of 1999 Sep 28 File under Integrated Circuits, IC03 1999 Nov 22 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control FEATURES * Low DC line voltage; operates down to 1.5 V (excluding voltage drop across external polarity guard) * Line voltage regulator with adjustable DC voltage * 3.25 V regulated strong supply point for peripheral circuits compatible with: - Speech mode - Ringer mode - Trickle mode. * Transmit stage with: - Microphone amplifier with symmetrical high impedance inputs - DTMF amplifier with confidence tone on earpiece. * Receive stage with: - Earpiece amplifier with adjustable gain and volume control. * MUTE input for pulse or DTMF dialling * AGC line loss compensation for microphone and earpiece * LED control output. APPLICATIONS TEA1111A * Line powered telephone sets with LCD module * Cordless telephones * Fax machines * Answering machines. GENERAL DESCRIPTION The TEA1111A is a bipolar integrated circuit that performs all speech and line interface functions required in fully electronic telephone sets. It performs electronic switching between speech and dialling. The IC operates at a line voltage down to 1.5 V DC (with reduced performance) to facilitate the use of telephone sets connected in parallel. When the line current is high enough, a fixed amount of current is derived from the LN pin in order to create a strong supply point at pin VDD. The voltage at pin VDD is regulated to 3.25 V to supply peripherals such as dialler, LCD module and microcontroller. QUICK REFERENCE DATA Iline = 15 mA; VEE = 0 V; VVCI = 0 V; RSLPE = 20 ; AGC pin connected to VEE; Zline = 600 ; f = 1 kHz; measured according to test circuits given in Figs 14, 15 and 16; Tamb = 25 C; unless otherwise specified. SYMBOL Iline PARAMETER line current operating range CONDITIONS normal operation with reduced performance VLN ICC VCC VDD DC line voltage internal current consumption supply voltage for internal circuitry (unregulated) regulated supply voltage for peripherals speech mode ringer mode IDD Gv(TX) Gv(QR) Gv(QR) Gv(trx) available supply current for peripherals typical voltage gain for microphone amplifier typical voltage gain for earpiece amplifier volume control range for earpiece amplifier gain control range for microphone and earpiece amplifiers with respect to Iline = 15 mA Iline = 85 mA MUTE = LOW VMIC = 4 mV (RMS) VIR = 4 mV (RMS) IDD = -3 mA IDD = 75 mA 2.95 3.0 - 43.2 26.4 0 - - 3.25 3.3 - 44.2 27.4 14.5 6.0 80 3.55 3.6 -3 45.2 28.4 - - - V V mA dB dB dB dB dB VCC = 3.3 V IP = 0 mA MIN. 11 1 3.7 - - TYP. MAX. UNIT - - 4.0 1.15 3.3 140 11 4.3 1.4 - mA mA V mA V Gv(trx)(m) gain reduction for microphone and earpiece amplifiers 1999 Nov 22 2 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control ORDERING INFORMATION TYPE NUMBER TEA1111AT BLOCK DIAGRAM PACKAGE NAME SO16 DESCRIPTION plastic small outline package; 16 leads; body width 3.9 mm TEA1111A VERSION SOT109-1 handbook, full pagewidth VCI receive amplifier V I 9 VOLUME CONTROL GAR 12 IR 4 11 earpiece amplifier QR MUTE 8 V I 0.5VCC CURRENT AND VOLTAGE REFERENCE DTMF 6 ATTENUATOR 16 VDD V I REGULATOR 7 VCC VDD MIC+ MIC- 13 14 V I 1 LN microphone amplifier 10 AGC CIRCUIT VEE LOW VOLTAGE CIRCUIT AGC 5 TEA1111A 3 REG LED CONTROL 15 LEDC 2 SLPE FCA051 Fig.1 Block diagram. 1999 Nov 22 3 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control PINNING SYMBOL LN SLPE REG IR AGC DTMF VDD MUTE VCI VEE QR GAR MIC+ MIC- LEDC VCC PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION positive line terminal slope (DC resistance) adjustment line voltage regulator decoupling receive amplifier input automatic gain control/ line loss compensation dual-tone multi-frequency input regulated supply for peripherals mute input to select speech or dialling mode (active LOW) volume control input negative line terminal earpiece amplifier output earpiece amplifier gain adjustment non-inverting microphone amplifier input inverting microphone amplifier input LED control output supply voltage for internal circuit The voltage at pin LN is: VLN = Vref + RSLPE x ISLPE ISLPE = Iline - ICC - IP - ISUP - ILEDC where: Iline = line current ICC = current consumption of the IC handbook, halfpage TEA1111A LN 1 SLPE 2 REG 3 IR 4 16 VCC 15 LEDC 14 MIC- 13 MIC+ TEA1111A AGC 5 DTMF 6 VDD 7 MUTE 8 FCA052 12 GAR 11 QR 10 VEE 9 VCI Fig.2 Pin configuration. FUNCTIONAL DESCRIPTION All data given in this chapter concerns typical values, except when otherwise specified. Supply (pins LN, SLPE, REG, VCC and VDD) The supply for the TEA1111A and its peripherals is obtained from the telephone line (see Fig.3). THE LINE INTERFACE (PINS LN, SLPE AND REG) The IC generates a stabilized reference voltage (Vref) across pins LN and SLPE. Vref is temperature compensated and can be adjusted by using an external resistor (RVA). Vref equals 3.8 V and can be increased by connecting RVA between pins REG and SLPE or decreased by connecting RVA between pins REG and LN. The voltage at pin REG is used by the internal regulator to generate Vref and is decoupled by CREG, which is connected to VEE. This capacitor, converted to an equivalent inductance, (see Section "Set impedance") determines the set impedance conversion from its DC value (RSLPE) to its AC value (RCC in the audio-frequency range). The voltage at pin SLPE is proportional to the line current. IP = supply current for external circuits ISUP = current consumed between LN and VEE by the VDD regulator ILEDC = supply current for external LED circuitry. The preferred value for RSLPE is 20 . Changing RSLPE will affect more than the DC characteristics; it also influences the microphone and DTMF gains, the gain control characteristics, the sidetone level and the maximum output swing on the line. The DC line current flowing into the set is determined by the exchange supply voltage (VEXCH), the feeding bridge resistance (REXCH), the DC resistance of the telephone line (Rline) and the reference voltage (Vref). With line currents below Ilow (9 mA), the internal reference voltage (generating Vref) is automatically adjusted to a lower value. 1999 Nov 22 4 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control This means that several sets can operate in parallel with DC line voltages (excluding the polarity guard) down to an absolute minimum voltage of 1.5 V. At line currents below Ilow, the circuit has limited sending and receiving levels. This is called the low voltage area. THE INTERNAL SUPPLY POINT (PIN VCC) The internal circuitry of the TEA1111A is supplied from pin VCC. This voltage supply is derived from the line voltage by means of a resistor (RCC) and must be decoupled by a capacitor CVCC. It may also be used to supply some external circuits. TEA1111A The VCC voltage (see also Figs 4 and 5) depends on the current consumed by the IC and the peripheral circuits as: VCC0 = VLN - RCC x ICC VCC = VCC0 - RCC x (IP + Irec) Where Irec is the current consumed by the output stage of the earpiece amplifier. handbook, full pagewidth Rline ILEDC Iline ILN LN RCC ICC VCC ISUP CVCC LED CIRCUIT LEDC from preamplifier 100 F internal circuitry VDD IDD IP REXCH LED CONTROL VDD REGULATOR external circuits VEXCH SLPE REG CREG 4.7 F TEA1111A VEE peripherals CVDD 220 F ISLPE RSLPE 20 FCA053 Fig.3 Supply configuration. 1999 Nov 22 5 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A handbook, halfpage RCC VCC VCC0 Irec EXTERNAL CIRCUITS IP VEE MGK806 Fig.4 VCC used as supply voltage for external circuits. FCA054 handbook, halfpage 2 IP (mA) 1.6 1.2 0.8 (1) (2) 0.4 0 2.2 2.6 3.0 VCC (V) 3.4 VCC 2.2 V; VLN = 4 V at Iline = 15 mA; RCC = 619 ; RSLPE = 20 . (1) Curve 1 is valid when the earpiece amplifier is driven: VQR(rms) = 150 mV; RL = 150 . (2) Curve 2 is valid when the earpiece amplifier is not loaded. Fig.5 Typical current IP available from VCC for peripheral circuitry. 1999 Nov 22 6 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control THE REGULATED SUPPLY POINT (PIN VDD) The VDD regulator delivers a stabilized voltage for the peripherals in transmission mode (nominal VLN) as well as in ringer mode (VLN = 0 V). The regulator (see Fig.6) consists of a sense input circuit fed by pin LN, a current switch and a VDD output stabilizer. The regulator function depends on the transmission, ringer and trickle modes as follows: * Transmission mode: The regulator operates as a current source at the LN input; it takes a constant current of ISUP = 4.3 mA (at nominal conditions) from pin LN. The current switch reduces the distortion on the line at large signal swings. Output VDD follows the DC voltage at pin LN (with typically 0.35 V difference) up to VDD = 3.25 V. The input current of the regulator is constant while the output (source) current is determined by the consumption of the peripherals. The difference between input and output currents is shunted by the internal VDD stabilizer. TEA1111A * Ringer mode: The regulator operates as a shunt stabilizer to keep VDD at 3.3 V. The input voltage VLN equals 0 V while the input current into pin VDD is delivered by the ringing signal. VDD has to be decoupled by a capacitor CVDD. * Trickle mode: When VDD is below 2 V, the regulator is inhibited. The current consumption of the VDD regulator in trickle mode is very low to save most of the trickle current for memory retention of a dialler. handbook, full pagewidth Rline Iline I LN LN RCC I CC VCC VDD CVCC IDD SENSE SWITCH peripherals 100 F REXCH ISUP VEXCH VDD regulator CVDD TEA1111A VEE 220 F FCA055 Fig.6 VDD regulator configuration. 1999 Nov 22 7 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control LED control (pin LEDC) The TEA1111A gives an on-hook/off-hook status indication. This is achieved by a current made available at pin LEDC to drive an external LED circuit connected between pins SLPE and LN (see Fig.7). In the low voltage area, which corresponds to low line current conditions, no current is available for this LED. For line currents higher than a threshold, the LEDC current increases proportionally to the line current (with a ratio of 1:150). The LEDC current is internally limited to 470 A (see Fig.8). For 12 mA < Iline < 82 mA: I LEDC I line - 12 = -------------------150 BC858B TEA1111A LN 24 2.4 k LEDC This LED circuit is referenced to SLPE. Consequently, all the LED supply current will flow through the RSLPE resistor, and does not affect the behaviour of the AGC. Set impedance In the audio frequency range, the dynamic impedance is mainly determined by the RCC resistor. The equivalent impedance of the circuit is illustrated in Fig.9. SLPE FCA056 Fig.7 LED circuit configuration. FCA057 handbook, halfpage 500 I LEDC (A) handbook, halfpage LN RP REG CREG 4.7 F RCC 619 VCC CVCC 100 F MBE788 400 LEQ 300 SLPE RSLPE 200 VEE 100 20 Vref 0 0 20 40 60 80 I line (mA) 100 LEQ = CREG x RSLPE x RP. RP = internal resistance. RP = 17.5 k. Fig.8 LEDC current versus line current. Fig.9 Equivalent impedance between LN and VEE. 1999 Nov 22 8 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control Transmit stage (pins MIC+, MIC- and DTMF) MICROPHONE AMPLIFIER (PINS MIC+ AND MIC-) The TEA1111A has symmetrical microphone inputs. The input impedance between pins MIC+ and MIC- is 68 k (2 x 34 k). The voltage gain from pins MIC+/MIC- to pin LN is set at 44.2 dB (typical) at 600 line load. Automatic gain control is provided on this amplifier for line loss compensation. DTMF AMPLIFIER (PIN DTMF) When the DTMF amplifier is enabled, dialling tones may be sent on line. These tones are also sent to the receive output QR at a low level (confidence tone), the level is controlled by pin VCI. The TEA1111A has an asymmetrical DTMF input. The input impedance between DTMF and VEE is 20 k and it is biased at VEE. The voltage gain from pin DTMF to pin LN is set at 25.9 dB. Automatic gain control has no effect on the DTMF amplifier. Receiving stage (pins IR, GAR, QR and VCI) The receive part consists of an earpiece amplifier and a volume control block. EARPIECE AMPLIFIER The earpiece amplifier has one input (IR) and one output (QR). The input impedance between pin IR and pin VEE is 22 k. When pin VCI is tied to VEE, the voltage gain from pin IR to pin QR is set at 27.4 dB (typical) which reduces the attenuation of the receive signal by the anti-sidetone network from 32 dB to 4.6 dB. The gain can be decreased by connecting an external resistor RGARext between pins GAR and QR; the adjustment range is 6 dB. Two external capacitors CGAR (connected between pins GAR and QR) and CGARS (connected between pins GAR and VEE) ensure stability. Capacitor CGAR provides a first-order low-pass filter. The cut-off frequency corresponds to the time constant CGAR x RGARint. Where RGARint is the internal resistor (123 k typical) which sets the gain. The relationship CGARS = 10 x CGAR must be complied with to ensure stability. The output voltage of the earpiece amplifier is specified for continuous wave drive. The maximum output swing depends on the DC line voltage, the RCC resistor, the ICC current consumption of the circuit, the IP current consumption of the peripheral circuits and the load impedance. 1999 Nov 22 9 TEA1111A Automatic gain control is provided on this amplifier for line loss compensation. VOLUME CONTROL (PIN VCI) A positive DC voltage applied to pin VCI allows the gain of the earpiece amplifier to be increased in steps of 4.85 dB. The volume control range is 27.4 to 41.9 dB (14.5 dB typical). A proportional voltage decoder at pin VCI defines a gain of 27.4 dB when VVCI equals VEE and a gain of 41.9 dB when VVCI equals VDD. 1 The intermediate steps correspond to: V VCI = -- V DD 3 2 and V VCI = -- V DD . 3 Automatic gain control (pin AGC) The TEA1111A performs automatic line loss compensation. The automatic gain control varies the gain of the microphone amplifier and the gain of the receive amplifier in accordance with the DC line current. The control range is 6.0 dB (which corresponds approximately to a line length of 5 km for a 0.5 mm diameter twisted-pair copper cable with a DC resistance of 176 /km and an average attenuation of 1.2 dB/km). The IC can be used with different configurations of feeding bridge (supply voltage and bridge resistance) by connecting an external resistor RAGC between pins AGC and VEE. This resistor enables the Istart and Istop line currents to be increased (the ratio between Istart and Istop is not affected by the resistor). The AGC function is disabled when pin AGC is left open circuit. Mute function (pin MUTE) The mute function performs the switching between the speech mode and the dialling mode. When MUTE is LOW, the DTMF input is enabled and the microphone and receive amplifier inputs are disabled. In this mode, the DTMF tones are sent to the receive output at a low level (confidence tone). When MUTE is HIGH, the microphone and receiving amplifiers inputs are enabled while the DTMF input is disabled. The MUTE input is provided with an internal pull-up current source to VDD. Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control Sidetone suppression The TEA1111A anti-sidetone network comprising RCC // Zline, Rast1, Rast2, Rast3, RSLPE and Zbal (see Fig.10) suppresses the transmitted signal in the earpiece. Maximum compensation is obtained when the following conditions are fulfilled: R SLPE x R ast1 = R CC x ( R ast2 + R ast3 ) R ast2 x ( R ast3 + R SLPE ) k = -----------------------------------------------------------R ast1 x R SLPE Z bal = k x Z line The scale factor k is chosen to meet the compatibility with a standard capacitor from the E6 or E12 range for Zbal. In practice, Zline varies considerably with the line type and the line length. Therefore, the value of Zbal should be for an average line length, which gives satisfactory sidetone suppression with short and long lines. The suppression also depends on the accuracy of the match between Zbal and the impedance of the average line. TEA1111A The anti-sidetone network for the TEA1111A attenuates the receive signal from the line by 32 dB before it enters the receive stage. The attenuation is almost constant over the whole audio frequency range. A Wheatstone bridge configuration (see Fig.11) may also be used. More information on the balancing of an anti-sidetone bridge can be obtained in our publication "Semiconductors for Wired Telecom Systems; Applications Handbook IC03b". For ordering information, please contact the Philips Semiconductors sales office. handbook, full pagewidth LN Zline RCC Rast1 VEE Im IR Zir Rast2 RSLPE Rast3 SLPE Zbal MBE787 Fig.10 Equivalent circuit of TEA1111A anti-sidetone bridge. 1999 Nov 22 10 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A handbook, full pagewidth LN Zline RCC Zbal VEE Im IR Zir RSLPE Rast1 RA SLPE MBE786 Fig.11 Equivalent circuit of an anti-sidetone network in a Wheatstone bridge configuration. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VLN PARAMETER positive continuous line voltage repetitive line voltage during switch-on or line interruption IDD VCC Vn(max) Iline Ptot Tstg Tamb Tj maximum input current at pin VDD supply voltage maximum voltage on all pins except pins VDD, MUTE and VCI line current TEA1111AT total power dissipation storage temperature ambient temperature junction temperature CONDITIONS MIN. MAX. V V mA V UNIT VEE - 0.4 12 VEE - 0.4 13.2 - 75 VEE - 0.4 12 VMUTE, VVCI maximum voltage on pins MUTE and VCI VEE - 0.4 VDD + 0.4 V VEE - 0.4 VCC + 0.4 V RSLPE = 20 ; see Fig.12 - Tamb = 75 C; see Fig.12 - -40 -25 - 140 416 +125 +75 +125 mA mW C C C 1999 Nov 22 11 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Note 1. Mounted on epoxy board 40.1 x 19.1 x 1.5 mm. PARAMETER thermal resistance from junction to ambient CONDITIONS in free air; note 1 VALUE 110 TEA1111A UNIT K/W handbook, full pagewidth 150 FCA058 130 I LN (mA) 110 90 (4) (3) (2) (1) 70 50 30 2 3 4 5 6 7 8 9 10 11 VLN - VSLPE (V) 12 (1) (2) (3) (4) Tamb = 45 C; Ptot = 0.666 W. Tamb = 55 C; Ptot = 0.583 W. Tamb = 65 C; Ptot = 0.500 W. Tamb = 75 C; Ptot = 0.416 W. Fig.12 SO16 safe operating area (TEA1111AT). 1999 Nov 22 12 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A CHARACTERISTICS Iline = 15 mA; VEE = 0 V; VVCI = 0 V; RSLPE = 20 ; pin AGC connected to VEE; Zline = 600 ; f = 1 kHz; measured according to test circuits given in Figs 14, 15 and 16; Tamb = 25 C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply (pins LN, VCC, SLPE, REG and VDD) THE LINE INTERFACE (PINS LN, SLPE AND REG) Vref VLN stabilized reference voltage between pins LN and SLPE DC line voltage Iline = 1 mA Iline = 4 mA Iline = 15 mA Iline = 140 mA VLN(Rext) VLN(T) DC line voltage with an external resistor RVA DC line voltage variation with temperature referenced to 25 C internal current consumption supply voltage for internal circuitry RVA = 90 k (between pins LN and REG) Tamb = -25 to +75 C 3.5 - - 3.7 - - - 3.8 1.5 2.5 4.0 6.7 3.6 40 4.1 - - 4.3 7.2 - - V V V V V V mV THE INTERNAL SUPPLY POINT (PIN VCC) ICC VCC VCC = 3.3 V IP = 0 mA - - 1.15 3.3 1.4 - mA V THE REGULATED SUPPLY POINT (PIN VDD) ISUP input current of the VDD regulator (current from pin LN not flowing through pin SLPE) regulated supply voltage in: speech mode 2.95 IDD = -3 mA; VLN > 3.6 V + 0.28 V (typ.); Iline 11 mA Iline = 4 mA Iline = 0 mA; IDD = 75 mA - 3.0 3.25 3.55 V Iline = 1 mA Iline = 4 mA Iline 11 mA - - - 0 1.2 4.3 - - - mA mA mA VDD speech mode at reduced performance ringer mode IDD regulated supply current available in: speech mode speech mode at reduced performance trickle mode VLN - 0.35 - 3.3 3.6 V V Iline 11 mA Iline = 4 mA Iline = 0 mA; VCC discharging; VDD = 1.2 V - - - - -1 - -3 - 100 mA mA nA 1999 Nov 22 13 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control SYMBOL PARAMETER CONDITIONS - - - MIN. TYP. TEA1111A MAX. - - - UNIT LED control (pin LEDC) Iline(h) Iline(l) ILEDC(max) highest line current for ILEDC < 5 A lowest line current for maximum ILEDC maximum available output current from pin LEDC 13 82 470 mA mA A Transmit stage (pins MIC+, MIC- and DTMF) MICROPHONE AMPLIFIER (PINS MIC+ AND MIC-) Zi input impedance differential between pins MIC+ and MIC- single-ended between pins MIC+/MIC- and VEE Gv(TX) Gv(TX)(f) Gv(TX)(T) voltage gain from pins MIC+/MIC- to pin LN voltage gain variation with frequency referenced to 1 kHz voltage gain variation with temperature referenced to 25 C common mode rejection ratio Iline = 15 mA; THD = 2% Iline = 4 mA; THD = 10% VMIC = 4 mV (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C - - 43.2 - - 68 34 44.2 0.2 0.3 - - 45.2 - - k k dB dB dB CMRR - 1.8 - 80 2 0.45 -77 - - - - dB V V dBmp VLN(max)(rms) maximum sending signal (RMS value) Vno(LN) noise output voltage at pin LN psophometrically weighted - (P53 curve); pins MIC+/MIC- short circuited through 200 - VDTMF = 20 mV (RMS); MUTE = LOW f = 300 to 3400 Hz Tamb = -25 to +75 C 24.9 - - DTMF AMPLIFIER (PIN DTMF) Zi Gv(DTMF) Gv(DTMF)(f) input impedance voltage gain from pin DTMF to pin LN voltage gain variation with frequency referenced to 1 kHz 20 25.9 0.2 0.4 - 26.9 - - k dB dB dB Gv(DTMF)(T) voltage gain variation with temperature referenced to 25 C Gv(ct) voltage gain from pin DTMF to pin QR (confidence tone) VDTMF = 20 mV (RMS); RL = 150 ; MUTE = LOW; VVCI = 0 V - -15.6 - dB 1999 Nov 22 14 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control SYMBOL PARAMETER CONDITIONS MIN. TYP. TEA1111A MAX. UNIT Receive stage (pins IR, GAR, QR and VCI) THE EARPIECE AMPLIFIER (PINS IR AND QR) Zi Gv(QR) Gv(QR)(f) Gv(QR)(T) input impedance voltage gain from pin IR to pin QR voltage gain variation with frequency referenced to 1 kHz voltage gain variation with temperature referenced to 25 C voltage gain reduction range VIR = 4 mV (RMS); VVCI = 0 V f = 300 to 3400 Hz Tamb = -25 to +75 C - 26.4 - - 22 27.4 0.2 0.3 - 28.4 - - k dB dB dB Gv(QR) external resistor connected - between pins GAR and QR IP = 0 mA; sine wave drive; 0.5 RL = 150 ; THD = 2%; VVCI = VDD IP = 0 mA; sine wave drive; 0.8 RL = 450 ; THD = 2%; VVCI = VDD - 6 dB VQR(max)(rms) maximum receiving signal on pin QR (RMS value) 0.6 - V 0.9 - V Vno(QR)(rms) noise output voltage at pin QR (RMS value) IR open circuit; - RL = 150 ; VVCI = 0 V; psophometrically weighted (P53 curve) VVCI = VDD - 12 3.85 - -90 - dBVp -75 14.5 4.85 - 17 5.85 - dBVp VOLUME CONTROL (PIN VCI) Gv(QR)max Gv(QR)step Gv(trx) maximum increase in voltage gain step voltage gain VIR = 4 mV (RMS); VVCI = VDD VIR = 4 mV (RMS) Iline = 85 mA dB dB Automatic gain control (pin AGC) voltage gain control range for microphone and earpiece amplifiers w.r.t. Iline = 15 mA highest line current for maximum gain lowest line current for min. gain 6.0 dB Istart Istop VIL VIH IMUTE Gv(trx)(m) - - 23 59 - - mA mA Mute function (pin MUTE) LOW-level input voltage HIGH-level input voltage input current voltage gain reduction for: microphone amplifier earpiece amplifier DTMF amplifier 1999 Nov 22 MUTE = LOW MUTE = LOW MUTE = HIGH 15 - - - 80 80 80 - - - dB dB dB VEE - 0.4 - VEE + 1.5 - -10 -2 VEE + 0.3 V VDD + 0.4 V - A Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEST AND APPLICATION INFORMATION TEA1111A handbook, full pagewidth Rprot Cz D1 D2 AB 1N4004 D3 D4 Dz Vd 10 V Cemc 10 nF RCC Rz 619 CVCC 100 F LN SLPE VCC LEDC MIC- RTX3 IR AGC DTMF VDD MIC+ RTX2 2.4 k 24 BA BC858 Rast1 130 k CIR 100 nF Rast2 3.92 k Rast3 392 Rbal1 130 Cbal 220 nF Rbal2 820 CREG 4.7 F RAGC CDTMF DTMF 220 nF RSLPE 20 peripheral supply VEE VDD RTX1 CMIC- MIC- CMIC+ MIC+ CEAR REG TEA1111A QR RGARext GAR VEE R VCI 2R VCI 0 CGAR 10 F 100 pF 1 nF CGARS VCI1 earpiece CVDD MUTE 220 F FCA059 MUTE Fig.13 Basic application diagram. 1999 Nov 22 16 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A Iline handbook, full pagewidth RCC 619 24 2.4 k 3 mA CVCC 100 F CVDD ILN LN BC858 100 F Iline VO VMIC MIC+ DTMF SLPE 600 VDTMF RSLPE 20 CREG 4.7 F REG AGC VEE LEDC VCC ICC VDD IDD 220 F 10 F R L QR IR MIC- RGARext CGAR CGARS TEA1111A GAR MUTE VCI S1 FCA060 VO Voltage gain defined as Gv = 20 log ------ ; VI = VMIC or VDTMF. VI Microphone gain: S1 = open. DTMF gain: S1 = closed. Inputs not being tested should be open circuit. Fig.14 Test circuit for defining transmit gains. 1999 Nov 22 17 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A I full handbook, linepagewidth RCC 619 24 2.4 k 3 mA CVCC 100 F CVDD ILN LN BC858 100 F Iline LEDC IR MIC- VCC ICC VDD IDD 220 F VO 10 F R L QR RGARext GAR CGARS CGAR TEA1111A VIR 220 nF 600 VDTMF MIC+ DTMF SLPE REG AGC VEE MUTE VCI RSLPE 20 CREG 4.7 F S1 EVCI FCA061 VO Voltage gain defined as Gv = 20 log ------ ; VI = VIR or VDTMF. VI Earpiece gain: S1 = open. Confidence tone: S1 = closed. Inputs not being tested should be open circuit. Fig.15 Test circuit for defining earpiece gains. 1999 Nov 22 18 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control TEA1111A handbook, full pagewidth RCC 619 LN IR MIC- MIC+ VCC VDD QR TEA1111A GAR VDD VCI 10 F IDD VCC DTMF LEDC REG AGC SLPE VEE MUTE CREG 4.7 F RSLPE 20 FCA062 Inputs not being tested should be open circuit. Fig.16 Test circuit for defining regulated supply (VDD) performance in ringer and trickle modes. 1999 Nov 22 19 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 3.9 mm TEA1111A SOT109-1 D E A X c y HE vMA Z 16 9 Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012 0.010 0.057 0.004 0.049 0.019 0.0100 0.39 0.014 0.0075 0.38 0.244 0.041 0.228 8 0o o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 1999 Nov 22 20 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: TEA1111A * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 1999 Nov 22 21 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable suitable TEA1111A REFLOW(1) 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. 1999 Nov 22 22 Philips Semiconductors Product specification Speech circuit with dialler interface, regulated supply and earpiece volume control NOTES TEA1111A 1999 Nov 22 23 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999 Internet: http://www.semiconductors.philips.com SCA 68 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 465002/02/pp24 Date of release: 1999 Nov 22 Document order number: 9397 750 06482 |
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